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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/043061
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of achieving high HLM rim protrusion resolving ability while maintaining a polishing rate. Also provided is a polishing composition for preliminarily polishing the surface of a silicon material. The polishing composition contains abrasive grains, a basic compound, a water-soluble polymer, and water. The water-soluble polymer contains a nonionically modified polyvinyl alcohol-based polymer. Here, the nonionically modified polyvinyl alcohol-based polymer does not include a hydroxyl group in a modified structural unit.

Inventors:
ASADA MAKI (JP)
KAWANO TOMOAKI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2023/028817
Publication Date:
February 29, 2024
Filing Date:
August 07, 2023
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
WO2019124442A12019-06-27
WO2020196645A12020-10-01
WO2018043504A12018-03-08
Foreign References:
JP2020132695A2020-08-31
JP2020035870A2020-03-05
Attorney, Agent or Firm:
ABE, Makoto (JP)
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