POLISHING COMPOSITION

Title:

POLISHING COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2022/168860

Kind Code:

A1

Abstract:

The present invention provides a polishing composition which contains abrasive grains, a permanganate salt, an aluminum salt and water. With respect to this polishing composition, the concentration W1 (% by weight) of the abrasive grains, the concentration C1 (mM) of the permanganate salt and the concentration C2 (mM) of the aluminum salt satisfy at least one of the conditions (A), (B) and (C) described below.　(A) Both 500 ≤ (C1/W1) and 0.04 ≤ (C2/C1) are satisfied.　(B) Both 200 ≤ (C1/√(W1)) and 8 ≤ C2 are satisfied.　(C) Both 500 ≤ (C1/W1) and 8 ≤ C2 are satisfied.

More Like This:

WO/2024/004751	POLISHING MATERIAL SLURRY AND POLISHING METHOD OF SAME
JP3990559	Aqueous dispersion for polishing a semiconductor substrate or a layer applied on the semiconductor substrate and a method for producing the same.
JP7236270	Polishing liquid composition

Inventors:

NAKAGAI YUICHIRO (JP)
ITO YASUAKI (JP)
ODA HIROYUKI (JP)
IDE SHOGAKU (JP)
TAKAMI SHINICHIRO (JP)

Application Number:

PCT/JP2022/004020

Publication Date:

August 11, 2022

Filing Date:

February 02, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJIMI INC (JP)

International Classes:

C09G1/02; B24B37/00; C09K3/14; H01L21/304

Domestic Patent References:

WO2018174008A1	2018-09-27
WO2020087721A1	2020-05-07

Foreign References:

JP2020527612A	2020-09-10
JP2017105980A	2017-06-15
JP2021016870A	2021-02-15
JP2020527612A	2020-09-10

Attorney, Agent or Firm:

ABE, Makoto (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: POLISHING METHOD AND POLISHING COMPOSITION

Next Patent: THERAPEUTIC AGENT FOR AUTOIMMUNE DISEASES