Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/168858
Kind Code:
A1
Abstract:
The present invention provides a polishing composition which is capable of suppressing an increase in the temperature of a polishing pad during polishing. A polishing composition according to the present invention contains: water; an oxidant A that is selected from among compounds other than peroxides; a first metal salt that is selected from among alkaline earth metal salts; and a second metal salt that is selected from among salts of an anion and a cation of a metal in groups 3 to 16 of the periodic table.
Inventors:
ITO YASUAKI (JP)
ODA HIROYUKI (JP)
NAKAGAI YUICHIRO (JP)
IDE SHOGAKU (JP)
NOGUCHI NAOTO (JP)
TAKAMI SHINICHIRO (JP)
ODA HIROYUKI (JP)
NAKAGAI YUICHIRO (JP)
IDE SHOGAKU (JP)
NOGUCHI NAOTO (JP)
TAKAMI SHINICHIRO (JP)
Application Number:
PCT/JP2022/004018
Publication Date:
August 11, 2022
Filing Date:
February 02, 2022
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| WO2018174008A1 | 2018-09-27 | |||
| WO2019138846A1 | 2019-07-18 |
Foreign References:
| JP2020527612A | 2020-09-10 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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