Title:
PLATING DEVICE AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/033999
Kind Code:
A1
Abstract:
A plating device comprising: a plating tank configured so as to accommodate a plating solution; a substrate holder configured so as to hold a substrate to be plated; a rotating mechanism which rotates the substrate holder; a raising/lowering mechanism which raises/lowers the substrate holder; and a control unit. The substrate holder is equipped with: a contact member configured so as to come into contact with the substrate to enable power supply; a seal member configured so as to fill the gap between the substrate holder and the substrate; a liquid-holding part having the contact member inside and configured so as to hold a liquid when the gap between the substrate holder and the substrate is filled by the seal member; and an ejection port which is open to the liquid-holding part or to a space lying inside the substrate holder and communicating with the liquid-holding part or can be disposed on a lateral side of the substrate holder and which has been configured so that the liquid is ejected.
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Inventors:
TSUJI KAZUHITO (JP)
Application Number:
PCT/JP2022/030375
Publication Date:
February 15, 2024
Filing Date:
August 09, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D17/06
Foreign References:
| US20040140203A1 | 2004-07-22 | |||
| JP2019026863A | 2019-02-21 | |||
| JP7081063B1 | 2022-06-06 | |||
| JP2009293088A | 2009-12-17 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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