Title:
PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/084584
Kind Code:
A1
Abstract:
The purpose of the present invention is to suppress the adhesion of a wafer to a back plate assembly. This plating apparatus comprises: a plating bath configured so as to accommodate a plating solution; a wafer holder configured so as to hold a wafer Wf such that a surface to be plated Wf-a thereof is oriented downward; and a raising/lowering mechanism configured so as to raise and lower the wafer holder. The wafer holder comprises: a support mechanism 460 configured so as to support the outer periphery of the surface to be plated Wf-a of the substrate Wf; a back plate assembly 470 that is disposed on the reverse surface side of the wafer Wf from the surface to be plated Wf-a, and is configured so as to sandwich the wafer Wf together with the support mechanism 460; and a separation mechanism 471 configured so as to apply force for separating the wafer Wf from the back plate assembly 470 to the reverse surface of the wafer Wf from the surface to be plated Wf-a.
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Inventors:
TOMITA MASAKI (JP)
Application Number:
PCT/JP2021/041137
Publication Date:
May 19, 2023
Filing Date:
November 09, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D7/12; C25D17/06
Foreign References:
| JP6899040B1 | 2021-07-07 | |||
| JP2018009215A | 2018-01-18 | |||
| JP2008190043A | 2008-08-21 | |||
| JP2004076022A | 2004-03-11 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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