PLATING APPARATUS AND PLATING METHOD

WIPO Patent Application WO/2020/129145

A1

[Problem] To provide a plating apparatus and plating method whereby plating treatment can be satisfactorily performed even when a long sheet as the material to be plated has a large electrical resistance, and also whereby adhesion of a metal thin film of copper or the like to the surface of the long sheet is enhanced, and a long sheet is obtained that is provided with a high-quality plating treatment and on which a nickel metal coating is formed. [Solution] A plating apparatus 10 for continuously conveying a long sheet 18 as a material to be plated between an unwinding-side roll 12 and a winding-side roll 14 via a hollow cathode roll 16, and supplying electricity to the long sheet 18 from the cathode roll 16 while conveying the long sheet 18 through a plating tank 24 in which an anode 22 submerged in a plating liquid 20 is provided, thereby performing an electroplating treatment on the long sheet 18, is furthermore configured so that the cathode roll 16 is provided upstream from the plating tank 24 in the conveyance direction of the long sheet 18, and so that the distance of the cathode roll 16 from an upstream-side entrance of the plating tank 24 is in the range of 150 mm or less.

KOHTOKU MAKOTO (JP)
EDA TETSURO (JP)
MURAYAMA TAKASHI (JP)

PCT/JP2018/046486

June 25, 2020

December 18, 2018

Click for automatic bibliography generation  

JCU CORP (JP)

C25D19/00; C23C28/02; C25D3/38; C25D21/00

JP2009532588A	2009-09-10
JPS61119699A	1986-06-06
JP2007291507A	2007-11-08
JPH093691A	1997-01-07
JP2010045232A	2010-02-25
JP2013087324A	2013-05-13

FUJII Kenichi (JP)

View/Download PDF      PDF Help

Previous Patent: ANGLE DETECTION DEVICE AND ELECTRIC POWER STEERING DEVICE USING SAME

Next Patent: DISPLAY CONTROL DEVICE AND DISPLAY CONTROL METHOD