Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/150657
Kind Code:
A1
Abstract:
The present invention prevents degradation of uniformity of the thickness of a plating film due to organic material adhering to an edge section of a substrate and/or an oxide film formed on the edge section of the substrate. A plating apparatus for plating a substrate is provided. This plating apparatus has a plating bath for applying a voltage to a substrate set in a substrate holder and plating the substrate, and an edge section washing device for locally removing an organic material and/or an oxide film present on an edge section of the substrate before the substrate is set in the substrate holder.
Inventors:
NAGAI MIZUKI (JP)
SHIMOYAMA MASASHI (JP)
KISHI TAKASHI (JP)
NISHIURA FUMITOSHI (JP)
SHIMOYAMA MASASHI (JP)
KISHI TAKASHI (JP)
NISHIURA FUMITOSHI (JP)
Application Number:
PCT/JP2017/008256
Publication Date:
September 08, 2017
Filing Date:
March 02, 2017
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D17/00; C23G1/02; C25D5/34; C25D7/12; C25D17/06; H01L21/288
Domestic Patent References:
| WO2001099168A1 | 2001-12-27 |
Foreign References:
| JP2005019802A | 2005-01-20 | |||
| JP2008112772A | 2008-05-15 | |||
| JPH0794450A | 1995-04-07 | |||
| JPH05160105A | 1993-06-25 | |||
| JP2014216393A | 2014-11-17 | |||
| JP2004076022A | 2004-03-11 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
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