Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PIPE SUPPORT
Document Type and Number:
WIPO Patent Application WO/2020/241564
Kind Code:
A1
Abstract:
Provided is a pipe support which has a simple configuration, and which allows good workability when performing piping work. A pipe support (10) is provided with a tongue buckle (20) including a base portion (21) and fastening pieces (22, 23), a band piece (30) including a suspended portion (31) to be attached to the fastening piece (22) and a supporting portion (32) for supporting a portion of a circumferential surface of a pipe (P), a band piece (40) including a suspended portion (41) to be attached to the fastening piece (23) and a supporting portion (42) for supporting another portion of the circumferential surface of the pipe (P), and a nut (70) and a bolt (60) which is inserted through round holes formed in the fastening pieces (22, 23) and the suspended portion (31) and an elongated hole (41a) formed in the suspended portion (41) to tighten the fastening pieces (22, 23) and the suspended portions (31, 41) together, wherein: the suspended portion (41) is provided with a contacting piece (43) which comes into contact with the fastening piece (23) when tightened to the fastening pieces (22, 23) and the suspended portion (31), and an inclined piece (44) which extends upward from an upper portion of the contacting piece (43) in a direction moving away from the fastening piece (23); and the elongated hole (41a) is formed extending along the contacting piece (43) and the inclined piece (44).

Inventors:
OHNO KYOSUKE (JP)
YONEDA MAMORU (JP)
Application Number:
PCT/JP2020/020531
Publication Date:
December 03, 2020
Filing Date:
May 25, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NICHIEI INTEC CO LTD (JP)
International Classes:
F16L3/14
Foreign References:
US20190017630A12019-01-17
KR101645922B12016-08-05
KR20170067608A2017-06-16
JP2014214868A2014-11-17
JP2018013179A2018-01-25
Attorney, Agent or Firm:
MATSUDA Junichi et al. (JP)
Download PDF: