Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/203010
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition comprising a cyclized resin or a precursor thereof, a solvent B having an SP value of at least 21.0 (J/cm3)0.5 and less than 25.0 (J/cm3)0.5, a solvent C having an SP value of less than 21.0 (J/cm3)0.5 or at least 25.0 (J/cm3)0.5 and having a boiling point of at least 60 °C, and a photosensitive agent, wherein the content of the solvent C with respect to the total mass of the photosensitive resin composition is 1-10,000 ppm; a cured product formed by curing the photosensitive resin composition; a laminate including the cured product; a method for producing the cured product; and a semiconductor device including the cured product or the laminate.
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Inventors:
YOSHIDA KENTA (JP)
Application Number:
PCT/JP2022/014061
Publication Date:
September 29, 2022
Filing Date:
March 24, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/037; G03F7/075; G03F7/20; H01L21/312
Domestic Patent References:
| WO2018221457A1 | 2018-12-06 |
Foreign References:
| JP2018160665A | 2018-10-11 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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