Title:
PHOTORESIST STRIPPING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/140345
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a photoresist stripping composition that exhibits a high stripping performance even with respect to a hardened resist, and that, even when the amount of water in the make-up is small, experiences little decrease in stripping performance when water evaporates and makes it possible to inhibit corrosion of a substrate-constituting metal that comes into contact with a liquid, such as Cu, Al, or Si. The above is accomplished by a photoresist stripping composition containing (A) a quaternary ammonium hydroxide, (B) a sugar alcohol, (C) an amine, (D) water, (E) DMSO, and (F) ethylene glycol, the (D) water content being 1.0-10 mass% relative to the total mass of the composition.
Inventors:
ITO TSUBASA (JP)
SASAKI RYO (JP)
SHIMIZU TOSHIKAZU (JP)
SASAKI RYO (JP)
SHIMIZU TOSHIKAZU (JP)
Application Number:
PCT/JP2023/001641
Publication Date:
July 27, 2023
Filing Date:
January 20, 2023
Export Citation:
Assignee:
KANTO KAGAKU (JP)
International Classes:
G03F7/42; C11D7/26; C11D7/32; C11D7/34; C11D7/50; H05K3/06
Domestic Patent References:
| WO2017065153A1 | 2017-04-20 |
Foreign References:
| JP2020173301A | 2020-10-22 |
Attorney, Agent or Firm:
KUZUWA, Kiyoshi (JP)
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