Title:
PHOTOCURABLE RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2024/053548
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photocurable resin sheet that is excellent in scratch resistance at high temperature. The present invention provides a photocurable resin sheet that contains (A) a high molecular compound with an epoxy group and (B) a low molecular compound with a photoinitiator group, wherein an epoxy functional group equivalent X of the high molecular compound (A) is 100 g/eq < X < 400 g/eq.
Inventors:
IKEDA JUN (JP)
KIMURA RYUICHI (JP)
TANAKA YUKIKO (JP)
KIMURA RYUICHI (JP)
TANAKA YUKIKO (JP)
Application Number:
PCT/JP2023/031771
Publication Date:
March 14, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08G59/32; C08G59/68; G02B1/04
Domestic Patent References:
| WO2014084030A1 | 2014-06-05 |
Foreign References:
| JPS60257444A | 1985-12-19 | |||
| JP2001181498A | 2001-07-03 | |||
| JP2018505879A | 2018-03-01 | |||
| US20110027702A1 | 2011-02-03 | |||
| JP2022091682A | 2022-06-21 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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