PATTERN FORMING METHOD

WIPO Patent Application WO/2019/163070

A1

The problem to be addressed by the present invention is to provide a pattern forming method capable of eliminating in a simple manner a non-continuous portion within a pattern, while keeping the pattern resistance low. The problem is solved by a pattern forming method comprising at least a printing step of printing a pattern intermediate body containing an electroconductive material over a base material 1, and a plating step of processing the pattern intermediate body by electroplating, wherein the pattern intermediate body printed in the printing step has a portion to be plated that is energized in the plating step and a non-continuous portion that is provided non-continuously with respect to the portion to be plated and that is not energized in the plating step, and in the plating step, a plating solution containing at least two or more types of metal salt of different metals and a complexing agent is used to perform electroplating thereby eliminating the non-continuous portion of the pattern intermediate body to form a pattern constituting the portion to be plated covered by a plating coat.

JP2006100546	WIRING BOARD HAVING MANY WIRING AREAS, PACKAGE FOR STORING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
JPH06260749	FORMING METHOD OF SOLDER LAYER

USHIKU MASAYUKI (JP)
OHYA HIDENOBU (JP)
HOSHINO HIDEKI (JP)
YAMAUCHI MASAYOSHI (JP)
OMATA TAKENORI (JP)
NIIZUMA NAOTO (JP)
AOYAMA RYO (JP)
URAYAMA KAZUHO (JP)

PCT/JP2018/006595

August 29, 2019

February 22, 2018

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KONICA MINOLTA INC (JP)

H05K3/24; H05K1/02

WO2017130869A1	2017-08-03
WO2016190224A1	2016-12-01

JP2017039109A	2017-02-23
JP2017066493A	2017-04-06
JP2017039109A	2017-02-23

See also references of EP 3758456A4

MARUYAMA Eiichi (JP)

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