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Title:
PAD AND PAD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/135928
Kind Code:
A1
Abstract:
A pad 1 (10) comprises a first layer 2, threadlike members 4, and a second layer 6. The first layer 2 includes a back surface 22 and a front surface 21 on the opposite of the back surface 22. The threadlike members 4 penetrate the first layer 2 and include a plurality of loops 41 (41a, 41b) and an engaging part 42. The plurality of loops 41 (41a, 41b) protrude from the front surface 21. The engaging part 42 joins the plurality of loops 41 (41a, 41b) and is at least partially disposed on the back surface 22. The second layer 4 includes a foam material and is bonded to the back surface 22.

Inventors:
KITAMURA TAKURO (JP)
Application Number:
PCT/JP2022/042652
Publication Date:
July 20, 2023
Filing Date:
November 17, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
INOUE MTP KK (JP)
International Classes:
A44B18/00; E01B9/68; F16B5/07
Foreign References:
JP6674504B22020-04-01
JP2000500403A2000-01-18
JPH10330694A1998-12-15
Attorney, Agent or Firm:
KT&S IP FIRM, P.C. (JP)
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