Title:
PACKAGING STRUCTURE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/231122
Kind Code:
A1
Abstract:
Provided in the embodiments of the present disclosure are a packaging structure, a manufacturing method therefor and a semiconductor device. The packaging structure comprises N first liners, each first liner consisting of an interconnection layer exposed by a via hole; and N redistribution layers, each redistribution layer covering an isolation layer and being electrically connected to a corresponding first liner of the N first liners, part of the first liners being arranged in parallel in a first direction at a position close to a first edge of a semiconductor functional structure; another part of the first liners being arranged in parallel in the first direction at a position close to a second edge of the semiconductor functional structure; part of areas exposed of each redistribution layer comprising second liners and third liners; the offset direction of the center point of each second liner relative to the center point of a corresponding first liner being same, and the offset distance of the center point of each second liner relative to the center point of the corresponding first liner being equal; and the relative position between the second liners and the third liners in part of the redistribution layers being different from the relative position between the second liners and the third liners in another part of the redistribution layers.
Inventors:
TIAN KAI (CN)
LI HONGWEN (CN)
QUAN CHANGHAO (CN)
CHEN LIANG (CN)
WANG YUXIA (CN)
GUO YINGDONG (CN)
LI HONGWEN (CN)
QUAN CHANGHAO (CN)
CHEN LIANG (CN)
WANG YUXIA (CN)
GUO YINGDONG (CN)
Application Number:
PCT/CN2022/102515
Publication Date:
December 07, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L21/66; H01L23/544
Foreign References:
| CN112582365A | 2021-03-30 | |||
| CN105548851A | 2016-05-04 | |||
| CN106920797A | 2017-07-04 | |||
| CN107424970A | 2017-12-01 | |||
| CN112864130A | 2021-05-28 | |||
| US20100314619A1 | 2010-12-16 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
Download PDF: