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Patent Searching and Data


Title:
PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/058167
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a packaging material that is a laminate of resins that have a low environmental impact and has the stiffness, cuttability, and gas barrier properties desired of a packaging material. The present invention relates to a packaging material that includes: at least one base material film that includes a polyolefin resin as a constituent component; and a heat-sealable resin film. The packaging material is characterized in that at least one of the base material films is a layered base material film that has a gas barrier layer, the thermal elongation of at least one base material film peeled from the packaging material as measured at 130°C using a thermomechanical analysis device is no more than 6% in both the MD direction and the TD direction, the straight cuttability of the packaging material is no more than 10 mm in the MD direction or the TD direction, the value of the loop stiffness of the packaging material is at least 140 mN/25 mm, and the oxygen transmittance of the packaging material at 23°C and 65% RH is no more than 60 ml/m2∙d∙MPa.

Inventors:
YAMAZAKI ATSUSHI (JP)
TOMATSU WAKATO (JP)
KASHIWA MITSUHIRO (JP)
IMAI TORU (JP)
Application Number:
PCT/JP2023/033180
Publication Date:
March 21, 2024
Filing Date:
September 12, 2023
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/32; B65D65/40
Domestic Patent References:
WO2021199637A12021-10-07
WO2022118680A12022-06-09
WO2023127594A12023-07-06
Foreign References:
JPH10329262A1998-12-15
JPH0655710A1994-03-01
JP2018167487A2018-11-01
JP2021169193A2021-10-28
JPH01159232A1989-06-22
JP2001277408A2001-10-09
JP2003025518A2003-01-29
US20220112018A12022-04-14
US20180126695A12018-05-10
CN104354418A2015-02-18
JP2023013250A2023-01-26
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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