Title:
PACKAGING MATERIAL AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/075193
Kind Code:
A1
Abstract:
This packaging material comprises: a plurality of cushioning materials which are detachably attached to lateral surface parts forming lateral surfaces of a casing of a product and which are covered with a cylindrical lateral-surface corrugated board surrounding the casing. The cushioning materials include a pair of cushioning materials that are formed so as to extend in a first direction which is along surfaces of the lateral surface parts and which is the axial direction of the lateral-surface corrugated board, and are attached to both ends of the lateral surface parts when seen in the first direction. The pair of cushioning materials have contact surfaces that make contact with the inner surface of the cylindrical lateral-surface corrugated board surrounding the casing, are arranged between the lateral-surface corrugated board and the casing, and support, by the contact surfaces, the lateral-surface corrugated board from the side on which the casing is disposed.
Inventors:
KEMMOTSU MASAKATSU (JP)
Application Number:
PCT/JP2022/037203
Publication Date:
April 11, 2024
Filing Date:
October 05, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B65D81/05
Domestic Patent References:
| WO2021234968A1 | 2021-11-25 |
Foreign References:
| JP2000153878A | 2000-06-06 | |||
| JP2003072877A | 2003-03-12 | |||
| JPH0995361A | 1997-04-08 | |||
| JP2014055024A | 2014-03-27 | |||
| JP2016145048A | 2016-08-12 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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