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Patent Searching and Data


Title:
OUTER PACKAGING MATERIAL FOR VACUUM HEAT INSULATION MATERIAL, VACUUM HEAT INSULATION MATERIAL, AND ARTICLE WITH VACUUM HEAT INSULATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/230185
Kind Code:
A1
Abstract:
The present disclosure provides an outer packaging material for a vacuum heat insulation material, the outer packaging material including: a heat-weldable film; and one or more gas barrier films located on a first main surface side of the heat-weldable film and having at least a gas barrier membrane composed of a metal or an inorganic compound, wherein at least one of the gas barrier films further has an inorganic layer-like compound film on a first main surface side or a second main surface side of the gas barrier membrane, and the inorganic layer-like compound film located farthest from the heat-weldable film is closer to the heat-weldable film than the gas barrier film located farthest from the heat-weldable film, in the thickness direction of the outer packaging material for a vacuum heat insulation material.

Inventors:
IMAI MASAHIRO (JP)
MUNEDA TAKU (JP)
MIZOSHIRI MAKOTO (JP)
Application Number:
PCT/JP2019/014688
Publication Date:
December 05, 2019
Filing Date:
April 02, 2019
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
F16L59/065; B32B9/00; B32B15/08; F16L59/02
Foreign References:
JP2017210986A2017-11-30
JPH11257574A1999-09-21
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
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