Title:
ORGANIC ADDITIVE FOR ELECTROLYTIC COPPER PLATING FOR FORMING HIGH-FLATNESS COPPER-PLATED FILM AND ELECTROLYTIC COPPER PLATING SOLUTION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2017/159965
Kind Code:
A1
Abstract:
An organic additive for electrolytic copper plating according to one aspect of the present invention is added to a copper plating solution for forming a copper film on a substrate with a pattern formed thereon, in an electrolytic plating manner, and contains at least two types of flattening agents to increase uniformity and flatness of the copper film formed on the pattern.
Inventors:
LEE MIN HYUNG (KR)
LEE WOON YOUNG (KR)
LEE WOON YOUNG (KR)
Application Number:
PCT/KR2016/014337
Publication Date:
September 21, 2017
Filing Date:
December 07, 2016
Export Citation:
Assignee:
KOREA IND TECH INST (KR)
International Classes:
C25D3/38; C25D5/02
Foreign References:
| JP5518925B2 | 2014-06-11 | |||
| JP4538049B2 | 2010-09-08 | |||
| JP2009541580A | 2009-11-26 | |||
| KR20070037349A | 2007-04-04 | |||
| KR20090016421A | 2009-02-13 | |||
| KR101657675B1 | 2016-09-22 |
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
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