OPTICAL DEVICE , OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING AN OPTICAL DEVICE

The present disclosure relates to an optical device , an optoelectronic device and to a method for manufacturing an optical device .

It is an obj ect to provide an optical device that can be ef ficiently manufactured .

A further obj ect is to provide an optoelectronic device comprising an optical device .

Another obj ect is to provide a method for ef ficiently manufacturing an optical device .

According to at least one aspect , the optical device comprises a molded body with a cuboid contour .

The molded body can comprise a moldable material and/or can be formed of a moldable material . The molded body is formed by a molding method . The use of a molding method to form the molded body may still be traceable .

That the molded body has a cuboid contour in particular means that the molded body has a contour in the shape of a rectangle in top view and in side view . The cuboid contour is for example given by imagined lines connecting the corners of the molded body . The cuboid contour can partially be filled with the molded body . The molded body may have the shape of a cuboid comprising a recess . The recess may extend from a first outer surface of the molded body to a second outer surface of the molded body . The first outer surface and the second outer surface of the molded body can, for example , be neighbouring surfaces of the molded body . The recess can be arranged such that the molded body confines the recess on at least one side . For example , the molded body may comprise the recess on two sides . That the molded body confines the recess in particular means , that the molded body protrudes the recess on the side of the recess facing away from the molded body .

In other words , the molded body can be described as a triangular prism, wherein adj acent to a triangular-shaped surface a cuboid is arranged . In particular, each triangularshaped surface may adj oin a cuboid . The cuboids and the triangular prism can close flush on at least one side forming an outer surface of the molded body . For example , the cuboids and the triangular prism close flush on two sides .

According to at least one aspect , the optical device comprises an inclined surface within the cuboid contour . For example , the optical device comprises exactly one inclined surface . That the inclined surface is arranged within the cuboid contour can mean, that the inclined surface is completely arranged within the cuboid contour . The inclined surface can adj oin the cuboid contour on at least one side . For example , the inclined surface can adj oin the cuboid contour on two sides .

According to at least one aspect , the optical device comprises a first coating . The first coating can be a reflecting coating . For example , the first coating can be configured to reflect impinging electromagnetic radiation, in particular visible light .

According to at least one aspect of the optical device , the first coating is arranged on the inclined surface . The first coating can fully cover the inclined surface . Alternatively, the first coating can only partially cover the inclined surface . The first coating is preferably applied at least on a part of the inclined surface on which light impinges in operation as intended .

According to at least one aspect of the optical device , the inclined surface forms an outer surface of the molded body . For example , the molded body comprises an inclined surface , for example exactly one inclined surface . It is also possible , that the optical device comprises exactly one inclined surface .

According to at least one aspect of the optical device , the molded body protrudes the inclined surface in a direction perpendicular to the inclined surface on at least one side of the inclined surface .

According to at least one aspect of the optical device , the optical device comprises a molded body with a cuboid contour, an inclined surface within the cuboid contour and a first coating, wherein the first coating is arranged on the inclined surface , the inclined surface forms an outer surface of the molded body and the molded body protrudes the inclined surface in a direction perpendicular to the inclined surface on at least one side of the inclined surface . An edge length of the optical device can be at least 100 pm, for example at least 500 pm, larger than 1 mm or larger than 3 mm . Further the edge length of the optical device can be smaller than 10 mm, in particular smaller than 4 mm .

The optical device has the advantage that it can be produced cost-ef fectively in a high volume process .

A further advantage of the optical device described herein is that due to the molded body protruding the inclined surface , the optical device can be implemented in a tilt-resistant manner into an optoelectronic device , for example . The parts of the molded body protruding the inclined surface can function as a support feature . The support feature can be configured to be in direct contact with a carrier in case the optical device is arranged on a carrier . Due to the first coating, light impinging on the first coating can be reflected and the optical device can be used as a reflector, for example as a 45 ° mirror .

According to at least one aspect of the optical device , the molded body comprises glass and/or plastics . For example , the molded body can consist of glass and/or plastics . The molded body can be translucent and/or transparent for impinging light . The material comprising glass and/or plastics can be moldable , for example .

According to at least one aspect of the optical device , the inclined surface is directly adj acent to two neighbouring outer surfaces of the molded body, and an angle between the inclined surface and a first neighbouring outer surfaces is larger than 30 ° . For example , the angle between the inclined surface and the first neighbouring outer surface of the molded body may be larger than 40 ° , for example equal to 45 ° . The sum of the angles between the inclined surface and each of the two neighbouring outer surfaces can be 90 ° . The optical device with the inclined surface can be used as a deflection mirror, for example as a 45 ° mirror .

According to at least one aspect , a second coating is arranged on part of an outer surface of the molded body . The second coating can be arranged on an outer surface of the molded body facing a carrier in the intended use . In this case , the second coating can comprise a solderable material , for example . Additionally and/or alternatively, the second coating can comprise and/or consist of a material which improves the coupling of impinging light into the molded body . The second coating can be applied to an incoupling surface of the molded body, for example .

The second coating can comprise a refractive index . The refractive index can be configured to enable an incoupling of the impinging light into the molded body . For example , for the wavelength of the impinging light the refractive index of the second coating can have a value between the refractive indices of the molded body and a surrounding medium . The surrounding medium can thereby adj oin the incoupling surface of the molded body .

An advantage of this embodiment is , that due to the second coating the optical device can function as a transmission prism . Further, as the optical device can comprise a solderable coating, implementing the optical device in an optoelectronic device is simpli fied . Furthermore , an optoelectronic device is provided . The optoelectronic device preferably comprises an optical device described herein . This means all features disclosed for the optical device are also disclosed for the optoelectronic device and vice-versa .

According to at least one aspect of the optoelectronic device , the optoelectronic device comprises a carrier, a light-emitting component , and an optical device described herein, wherein the light-emitting component is arranged on the carrier and the optical device is arranged on the carrier in the beam path of light emitted by the light-emitting component .

The carrier can comprise a main extension plane . The carrier may be a mechanically carrying component of the optoelectronic device . The carrier can have a three- dimensional configuration . The carrier may comprise a mounting surface . The mounting surface can be parallel or nearly parallel to the main extension plane of the carrier . Components , which can be arranged on the carrier can, for example , be arranged on the mounting surface of the carrier .

The light-emitting component can emit electromagnetic radiation . For example , the light-emitting component can comprise a laser or a light-emitting diode . The lightemitting component can be arranged on the carrier . This means , the light-emitting component can be arranged on the mounting surface of the carrier .

The light-emitting component can be configured to emit light directionally . For example , the light-emitting component can comprise a radiation emission surface . The radiation emission surface can be perpendicular or nearly perpendicular to the main extension plane of the carrier and/or to the mounting surface of the carrier . For example , the light can be emitted by the light-emitting component perpendicular to the radiation emission surface of the light-emitting component and/or parallel to the main extension plane of the carrier .

The optical device can be arranged on the carrier . For example , the optical device is arranged on the mounting surface of the carrier . The optical device may be arranged in the beam path of the electromagnetic radiation emitted by the light-emitting component .

The optical device can be easily arranged on the carrier in a tilt-resistant manner . The production of the optoelectronic device can thus be facilitated .

According to at least one aspect of the optoelectronic device , the inclined surface of the optical device faces the light-emitting component . That the inclined surface of the optical device faces the light-emitting component can mean, that no parts of the molded body are arranged in the beam path between the light-emitting component and the optical device .

According to at least one aspect of the optoelectronic device , the inclined surface of the optical device faces the carrier . The inclined surface can form an angle with the mounting surface of the carrier . For example , a neighbouring outer surface , which is directly adj acent to the inclined surface can be in direct contact with the carrier . Preferably, the neighbouring outer surface runs parallel to the mounting surface of the carrier . The neighbouring outer surface can comprise parts protruding the inclined surface . An advantage of this aspect of the optoelectronic device is that the optical device can be arranged on the carrier in a tilt-resistant manner .

According to at least one aspect of the optoelectronic device , the inclined surface of the optical device faces away from the light-emitting component and a second coating is arranged on the outer surface of the molded body facing the light-emitting component .

Furthermore , a method for manufacturing an optical device is provided . The optical device described herein can preferably be manufactured by the method for manufacturing an optical device . This means all features disclosed for the optical device are also disclosed for the method for manufacturing an optical device and vice-versa .

According to at least one aspect , the method for manufacturing an optical device comprises a step wherein a molding tool is provided . The molding tool may comprise a metal . For example , the molding tool is made of a metal . The metal may be milled into a desired shape to form the molding tool . In the desired shape , the molding tool can comprise at least one molding surface . For example , the molding tool comprises an array of molding surfaces . The at least one molding surface can be an outer surface of a prism . For example , the molding tool comprises an array of prisms .

According to at least one aspect , the method for manufacturing an optical device comprises a step wherein a moldable material is provided . The moldable material can, for example, be moldable only at a specific temperature or within a specific temperature range. The specific temperature can be within 50°C and 1200°C, for example between 100°C and 800°C or between 500°C and 800°C. The specific temperature is equal to or larger than the glass-transition temperature of the moldable material.

According to at least one aspect, the method for manufacturing an optical device comprises a step wherein the moldable material is molded into an array of molded bodies, each comprising an inclined surface defined by the molding tool. This can be done by precision molding (deutsch: Prazisionsblankpressen) . For example, the moldable material is heated to a predetermined temperature, at which the moldable material is moldable. Then, the molding tool can be inserted into the moldable material at least partially. The molding tool can be inserted into the moldable material with the at least one molding surface facing the moldable material. The at least one molding surface can be partially and/or completely inserted into the moldable material. In other words, after inserting the molding tool into the moldable material the at least one molding surface directly adjoins the moldable material at least partially.

For example, each molded body in the array of molded bodies comprises an inclined surface, for example exactly one inclined surface, e.g. only one inclined surface. An extension of one molded body can be at least 100 pm, for example at least 500 pm, and at most 10 mm, for example at mo st 3 mm .

According to at least one aspect of the method for manufacturing an optical device, the molding tool comprises at least one molding surface for forming the inclined surface .

According to at least one aspect , the method for manufacturing an optical device comprises the following steps : providing a molding tool , providing a moldable material and molding the moldable material into an array of molded bodies , each comprising an inclined surface defined by the molding tool , wherein the molding tool comprises at least one molding surface for forming the inclined surface .

The method for manufacturing an optical device described herein has the advantage that a plurality of optical devices can be produced simultaneously and at low cost . The molding process can lead to an improved surface quality of the outer surfaces of the molded body . Thus , the molded bodies can be easily post-processed as less polishing is needed . Additionally, the method for manufacturing an optical device can have a high reproducibility .

According to at least one aspect of the method for manufacturing an optical device , a coating is applied to the molding tool . The coating can be configured so that the molding tool can be easily removed from the moldable material . The coating may be an anti-adhesive coating . Additionally and/or alternatively the coating can be a high- temperature coating . The coating can completely cover the molding tool on its side facing the moldable material during operation . Alternatively, the coating can only be applied to parts of the molding tool . Preferably, the coating is applied to the at least one molding surface of the molding tool . This way, the molding tool can be easily removed from the moldable material . Therefore , the surface quality of the molded bodies can be improved .

According to at least one aspect of the method for manufacturing an optical device , the moldable material comprises glass and/or plastics . These materials can be reversible transitioned from a hard state into a viscous and/or rubbery state . For example , the moldable material can be heated above a glass-transition temperature , molded into a desired shape and cooled to a temperature below the glasstransition temperature .

The moldable material comprising glass and/or plastics can have a suitable glass-transition temperature for the manufacturing process described herein .

According to at least one aspect of the method for manufacturing an optical device , the inclined surface of at least one of the molded bodies is polished after molding . The inclined surface can be chemically polished and/or thermically polished, for example . Due to the polishing, the surface quality of the inclined surface can be improved .

According to at least one aspect of the method for manufacturing an optical device a first coating is applied to the inclined surface of at least one of the molded bodies . For example , the first coating is simultaneously applied to the inclined surfaces in the array of molded bodies .

The process of coating can be simpli fied . As a plurality of inclined surfaces can be coated simultaneously with the first coating, the time needed for coating the inclined surfaces can be signi ficantly reduced .

According to at least one aspect of the method for manufacturing an optical device , the array of molded bodies is singulated into rods of molded bodies and a second coating is applied on an outer surface of a rod of molded bodies . The second coating can be a solderable coating . Additionally and/or alternatively, the second coating can be a coating which is configured to improve the incoupling of impinging light into the molded body . Alternatively, a third coating may be applied to another outer surface of the rods of molded bodies . For example , the outer surface of the molded body forming the incoupling surface can be coated with the second coating and an outer surface of the molded body, which is configured to be attached to a mounting surface of a carrier can be coated by a solderable third coating or vice versa .

As the second coating is applied on an outer surface of the rod of molded bodies , the coating can be applied to a plurality of molded bodies simultaneously . The method for manufacturing an optical device is simpli fied and less time consuming .

According to at least one aspect , the molding tool comprises an array of prisms . The molding tool can comprise a main body with a main extension plane and prisms protruding the main extensions plane of the main body or prisms extending into the main body of the molding tool . For example , the prisms extending into the main body of the molding tool form recesses in the main body of the molding tool . The prisms may comprise the molding surfaces . According to at least one aspect of the method for manufacturing an optical device the molding tool comprises a segment which is configured to form a truncated surface . The molding tool can comprise a main body with a main extension plane and molding surfaces protruding the main extensions plane of the main body or molding surfaces extending into the main body of the molding tool . For example , the molding surfaces extending into the main body of the molding tool form recesses in the main body of the molding tool . The segment , which is configured to form a truncated surface can be arranged at the bottom of a recess . Additionally or alternatively, the segment can be located on an outer surface of the main body of the molding tool . Additionally or alternatively, the molding tool comprises an array of prisms and the segment can be located at the part of the prism which protrudes the most from the main body of the molding tool . The segment can in particular run in parallel to the main extension plane of the molding tool .

According to at least one aspect of the method for manufacturing an optical device , an edge length of each molded body is at least 100 pm . For example , the edge length of the molded body can be an extension of the molded body . The extension of the molded body can be at least 100 pm, for example at least 500 pm . For example , the extension of the molded body is at most 10 mm, for example at most 3 mm .

Further advantages and advantageous designs and further developments of the optical device , the optoelectronic device and the method for manufacturing an optical device will become apparent from the following exemplary embodiments , which are described below in association with the figures . Figure 1 shows an optical device according to an embodiment .

Figure 2 shows a schematic cross-section through an optical device according to a further embodiment .

Figure 3 shows a molding tool according to an embodiment .

Figures 4 , 5 and 6 show views of an array of optical devices according to an embodiment .

Figure 7 shows a rod of optical devices according to an embodiment .

Figure 8 shows a molding tool according to a further embodiment .

Figures 9 , 10 and 11 show views of an array of optical devices according to a further embodiment .

Figure 12 shows a step in a method for manufacturing an optical device .

Figure 13 shows a rod of optical devices according to another embodiment .

Figure 14 shows an optical device according to an embodiment .

Figures 15 and 16 show views of an array of optical devices according to an embodiment .

Figure 17 shows rods of optical devices according to an embodiment . Figure 18 shows a rod of optical devices according to an embodiment .

Figure 19 shows an optical device according to an embodiment .

Figures 20 , 21 , 22 and 23 show flow diagrams of methods for manufacturing an optical device according to di f ferent embodiments .

Figure 24 shows an optoelectronic device according to an embodiment .

Identical , similar or equivalent elements are marked with the same reference signs in the figures . The figures and the proportions of the elements represented in the figures among each other are not to be considered as true to scale . Rather, individual elements may be oversi zed for better representability and/or comprehensibility .

Figure 1 shows an embodiment of an optical device 10 . The optical device 10 comprises a molded body 1 . The molded body 1 has a cuboid contour . The optical device 10 further comprises an inclined surface 2 within the cuboid contour .

The inclined surface 2 forms an outer surface of the molded body 1 .

A first coating 3 is applied to the inclined surface 2 . The first coating 3 is thereby arranged on the side of the inclined surface 2 facing away from the molded body 1 .

The inclined surface 2 is adj acent to two neighbouring outer surfaces 4 , 5 of the molded body 1 . An angle 7 between the inclined surface 2 and the first neighbouring outer surface 4 of the molded body 1 is larger than 30 ° . For example , the angle 7 can be 45 ° . An outer surface 8 of the molded body 1 which is arranged on an opposite side of the inclined surface 2 can be an incoupling side of the molded body 1 . A further outer surface 9 of the molded body 1 can be a mounting surface 9 of the optical device 10 .

Figure 2 shows a cross-section of an optical device 10 according to an embodiment . The inclined surface 2 forms an outer surface of the molded body 1 . A first coating 3 is applied to the inclined surface 2 . The second coating 6 is arranged on a further outer surface of the molded body 1 . The further outer surface is arranged on a side of the molded body 1 facing away from the inclined surface 2 . The further outer surface can be the incoupling surface 8 of the optical device 10 . The first coating 3 may be a reflective coating . The second coating 6 can be a solderable coating and/or a coating for improving the incoupling of impinging electromagnetic radiation into the molded body 1 . The second coating 6 can for example be applied to the incoupling surface 8 of the molded body 1 .

Figure 3 shows a molding tool 11 used in a method for manufacturing an optical device 10 according to an embodiment . The molding tool 11 comprises an array of prisms . The prisms are arranged laterally spaced apart . The distance between the prisms can correspond to a distance between the produced optical devices . Each prism comprises a molding surface 12 . The molding surface 12 is configured to mold the inclined surface 2 of the molded body 1 . The prisms protrude a main body of the molding tool 11 . Figure 4 shows an array 15 of molded bodies 1 and/or optical devices 10 . The array 15 of molded bodies 1 can be produced with a molding tool 11 as shown in figure 3 , for example . Each optical device 10 in the array of optical devices 10 can comprise an inclined surface 2 , for example exactly one inclined surface 2 or only one inclined surface 2 .

In figure 5 a cross-sectional view of the array 15 of molded bodies 1 along the line A shown in figure 4 is displayed .

In figure 6 a cross-sectional view of the array 15 of molded bodies 1 along the line B shown in figure 4 is depicted .

Figure 7 shows a rod 14 of optical devices 10 . The rod 14 can be formed by singulating the array 15 of molded bodies 1 or of optical devices 10 shown in figure 4 into rods 14 . In the rod 14 , the optical devices 10 or the molded bodies 1 are preferably arranged such that the second neighbouring surfaces 5 of the respective molded bodies 1 are aligned to form a plane . The rods 14 can be formed by cutting the array 15 shown in figure 4 along the line A and along a line which extends parallel to the line A.

Figure 8 shows a molding tool 11 according to a further embodiment . The molding tool 11 shown in figure 8 di f fers from the molding tool 11 shown in figure 3 in that the prisms of the array of prisms of the molding tool extend into the main body of the molding tool 11 . For example , the prisms form recesses in the main body of the molding tool 11 . The molding tool 11 comprises an array of molding surfaces 12 . The molding surfaces 12 are configured to mold the inclined surfaces 2 . The molding tool 11 comprises a segment 18 which is configured to form a truncated surface 17 . Figure 9 shows an array 15 of molded bodies 1 or of optical devices 10 according to an embodiment . The molded bodies 1 are complementary to the molding tool 11 shown in figure 8 . The molded bodies 1 are arranged on a base layer 16 . The base layer 16 can, for example , comprise the same material as the molded bodies 1 .

In figure 10 and in figure 11 , cross-sectional views of the array 15 of molded bodies 1 or optical devices 10 shown in figure 9 are shown . For example , each optical device 10 in the array of optical devices 10 can comprise an inclined surface 2 , for example exactly one inclined surface 2 or only one inclined surface 2 .

Figure 12 shows a step in a method for manufacturing an optical device 10 . In this method step, the array 15 of molded bodies 1 is singulated into rods 14 of molded bodies 1 . Each rod 14 comprises a base layer 16 .

Figure 13 shows a rod of optical devices 10 according to an embodiment . The inclined surfaces 2 of the optical devices 10 within the rod 14 face in the same direction . The rod 14 comprises a main direction . The optical devices 10 are arranged spaced apart along the main direction .

Figure 14 shows an optical device 10 which can be produced with a method for manufacturing an optical device according to an embodiment . The optical device 10 comprises an inclined surface 2 . The first coating 3 is arranged on the inclined surface 2 . Figure 15 shows an array 15 of molded bodies 1 and/or optical devices 10 according to an embodiment . The array 15 comprises a main extension plane . The main extension plane is determined by two main directions . The molded bodies 1 and/or optical devices 10 are aligned along the main directions . The inclined surfaces 2 form an angle with the main extension plane of the array . In this embodiment , the inclined surfaces 2 of the molded bodies 1 and/or of the optical devices 10 in the array face in the same direction . The molded bodies 1 and/or the optical devices 10 in the array can be arranged laterally spaced apart . For example , the molded bodies 1 are spaced apart along at least one main direction .

The molded bodies 1 can be arranged on a base layer 16 . For example , the base layer 16 is integrally formed with the molded bodies 1 . The base layer 16 can comprise the same material as the molded bodies 1 . The molded bodies 1 comprise a truncated surface 17 , which is for example planar and parallel to a main extension plane of the array of molded bodies 1 . This means , parts of the outer surface of the molded bodies 1 opposite to the base layer 16 run in parallel to the base layer 16 . In a direction from the inclined surface 2 to the outer surface of the molded bodies 1 , which is perpendicular or nearly perpendicular to the base layer 16 , the truncated surface 17 can have an extension of at least 50 pm, for example of at least 100 pm or of at least 200 pm . Further the extension can be smaller than 5 mm, in particular smaller than 1 mm . Due to the truncated surface 17 a removal of the molding tool 11 after molding the moldable material 13 can be simpli fied .

Figure 16 shows a cross-sectional view of the array 15 of optical devices 10 along the line C shown in figure 15 . Figure 17 shows a step in which the array 15 of molded bodies 1 shown in figure 15 is singulated into rods 14 comprising a plurality of molded bodies 1 . For example , this singulation can be achieved by removing the base layer 16 . The base layer

16 can be removed by grinding, cutting, sawing, etching and/or polishing, for example .

Figure 18 shows a single rod 14 of the rods 14 shown in figure 17 . The rod 14 of optical devices 10 can be singulated into single optical devices 10 by cutting, for example .

Figure 19 shows an optical device 10 with a truncated surface

17 and an inclined surface 2 . A first coating 3 can be arranged on the inclined surface 2 . The optical device 10 is formed by singulating the rod 14 of optical devices 10 shown in figure 18 into optical devices 10 .

Figures 20 , 21 , 22 and 23 show flow diagrams of methods for manufacturing an optical device 10 according to di f ferent embodiments .

In figure 20 , a flow diagram of a method for manufacturing an optical device 10 is shown . The method comprises an optional first step S I , in which a moldable material is hot- formed and/or hot-embossed . This means , the moldable material 13 is prepared by hot forming such that it is suitable for a subsequent precision molding step S2 . After step S I , the moldable material 13 comprises a cuboid shape , for example .

In step S2 a molding tool 11 is applied to the moldable material 13 . In other words , the molding tool 11 is at least partially inserted into the moldable material 13 . Afterwards , the molding tool 11 is removed from the moldable material 13.

In step S2, an array 15 of molded bodies is formed of the moldable material 13.

In a polishing step S3, the inclined surfaces 2 of the respective molded bodies 1 are polished.

Afterwards, in a coating step S4, a first coating 3 is arranged on the inclined surfaces 2. The first coating 3 can be simultaneously applied to the inclined surfaces 2 of the molded bodies 1. An array 15 of optical devices 10 is formed.

In a singulation step S5, the array of optical devices 10 is singulated into a plurality of optical devices 10. Alternatively, at least two optical devices 10 can remain interconnected .

Figure 21 shows a flow diagram of a method for manufacturing an optical device 10 according to another embodiment. The steps SI and S2 are equal to the steps SI and S2 shown in figure 20.

In a subsequent step S3.1 the inclined surfaces 2 of the molded bodies 1 are polished.

Afterwards, step S4.1 a first coating 3 is applied to the inclined surfaces 2. The first coating 3 can be applied to one inclined surface 2 at a time, to a group of inclined surfaces 2 at a time and/or simultaneously to a plurality of inclined surfaces 2 of the molded bodies 1. The coating 3 can comprise at least one layer. For example, more than one layer can be applied to the inclined surface 2 to form the coating 3. In this case, the further layer can also be applied to one inclined surface 2 or to a plurality of inclined surfaces 2 at a time .

In a step S5 . 1 the array 15 of molded bodies 1 can be singulated into rods 14 comprising a plurality of molded bodies 1 . The molded bodies 1 can preferably be arranged in the rods 14 such that outer surfaces of the molded bodies 1 , which are parallel to the neighbouring outer surfaces 4 , 5 close flush with each other . Preferably, the array 15 of molded bodies 1 is singulated into rods 14 such that a subsequently applied coating can be easily applied to the outer surfaces . Within the rod 14 , the plurality of inclined surfaces 2 can face in the same direction .

In step S3 . 2 the incoupling surface 8 of the molded bodies 1 can be polished . The incoupling surface 8 can be an outer surface of the molded bodies 1 opposing the inclined surfaces 2 .

In step S4 . 2 a second coating 6 can be applied to an outer surface of the molded body 1 . The second coating 6 can comprise a solderable material , for example . Additionally and/or alternatively, the second coating 6 can comprise and/or consist of a material which improves the incoupling of impinging light into the molded body 1 . The second coating 6 can be applied to the incoupling surface 8 of the molded body 1 , for example .

In a subsequent singulation step S5 . 2 , the rod 14 of optical devices 10 is singulated into a plurality of optical devices 10 . Alternatively, at least two optical devices 10 can remain interconnected . For example, the steps are executed in the order indicated in figure 21.

Figure 22 shows a flow diagram of a method for manufacturing an optical device 10 according to an embodiment. The steps SI, S2, S4.1, S5.1, S3, S4.2 and S5.2 shown in figure 22 correspond to the steps SI, S2, S4.1, S5.1, S3.2, S4.2 and S5.2 described in figure 21. The method shown in figure 22 can optionally comprise the step S3.1 shown in figure 21.

In a step S6, a base layer 16 can be removed.

For example, the steps are executed in the order indicated in figure 22.

Figure 23 shows a flow diagram of a method for manufacturing an optical device 10 according to an embodiment. The steps SI, S2, S4.1, S5.1, S3, S4.2 and S5.2 shown in figure 23 correspond to the steps SI, S2, S4.1, S5.1, S3.2, S4.2 and S5.2 described in figure 21. The method shown in figure 23 can optionally comprise the step S3.1 shown in figure 21.

Figure 24 shows an optoelectronic device 100 according to an embodiment. The optoelectronic device 100 comprises a carrier 30, a light-emitting component 20 and an optical device 10. The light-emitting component 20 and the optical device 10 are arranged on the mounting surface 31 of the carrier 30. The light-emitting component 20 generates and/or emits electromagnetic radiation 21 on a radiation emission surface 22. The optical device 10 is arranged in the beam path of the electromagnetic radiation 21 emitted by the light-emitting component 30. The optical device 10 can be arranged on the carrier 30 with an outer surface of the molded body 1 corresponding to a surface of the cuboid contour of the molded body 1 facing the carrier 30 . For example , as indicated with the dashed line , the inclined surface 2 can face the light-emitting component 20 . Alternatively, not shown, the inclined surface 2 can face away from the lightemitting component 20 . The optical device 10 can be arranged on the mounting surface 31 of the carrier 30 such that an extension of the molded body 1 between the inclined surface 2 and the surface on an opposing side of the molded body 1 , which runs perpendicular to the mounting surface 31 of the carrier 30 decreases or increases in a direction perpendicular to the mounting surface 31 of the carrier 30 towards the carrier 30 .

The invention described herein is not limited by the description given with reference to the embodiments . Rather, the invention encompasses any novel feature and any combination of features , including in particular any combination of features in the claims , even i f this feature or this combination is not itsel f explicitly indicated in the claims or embodiments .

This patent application claims the priority of German patent application 10 2022 119 766 . 2 , the disclosure content of which is hereby incorporated by reference .

References

1 molded body

2 inclined surface

3 first coating

4 first neighbouring outer surface

5 second neighbouring outer surface

6 second coating

7 angle

8 incoupling surface

9 mounting surface of the optical device

10 optical device

11 molding tool

12 molding surface

13 moldable material

14 rod of molded bodies/optical devices

15 array of molded bodies/optical devices

16 base layer

17 truncated surface

18 segment

20 light-emitting component

21 electromagnetic radiation

22 radiation emission surface

30 carrier

31 mounting surface

100 optoelectronic device