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Title:
NANOSTRUCTURE, METHOD FOR PRODUCING NANOSTRUCTURE, FILM, AND STRUCTURE PROVIDED WITH FILM
Document Type and Number:
WIPO Patent Application WO/2024/038769
Kind Code:
A1
Abstract:
A nanostructure according to one embodiment of the present disclosure is provided with a rough surface having an arithmetic mean height (Sa) of 0.09 μm to 1.21 μm, and a ratio (Sq/Sa) of the root mean square height (Sq) and the arithmetic mean height (Sa) of 1.22 to 2.36.

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Inventors:
NISHIMURA TAIZO (JP)
Application Number:
PCT/JP2023/028394
Publication Date:
February 22, 2024
Filing Date:
August 03, 2023
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
C08J5/18; A01N25/00; A01N25/34; A01N37/06; A01P3/00; A61L2/02; G02B1/18
Domestic Patent References:
WO2021161816A12021-08-19
Foreign References:
JP2017217773A2017-12-14
JP2020040934A2020-03-19
JP2018048320A2018-03-29
JP2019124908A2019-07-25
JP2021099436A2021-07-01
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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