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Title:
MUSHROOM CLUSTER CONTOUR SEGMENTATION AND RECONSTRUCTION METHOD BASED ON IMPROVED SOLOV2
Document Type and Number:
WIPO Patent Application WO/2024/077979
Kind Code:
A1
Abstract:
Disclosed in the present invention is a mushroom cluster contour segmentation and reconstruction method based on improved SOLOv2. The method comprises: first, segmenting a mushroom cluster image by means of a PR-SOLOv2 segmentation network, so as to obtain each sporocarp mask; then, extracting contour data of each sporocarp mask, and classifying each sporocarp according to the curvature and radius of the contour of each sporocarp mask; and then, according to a classification result, performing, by using a least-squares ellipse method, fitting reconstruction on sporocarps, the contours of which have regular shapes and are relatively smooth, and reconstructing, by means of a longest-contour extraction and classification reconstruction method based on corner segmentation, sporocarps which are heavily covered or squeezed and have irregular contours. By means of the present invention, the contours of sporocarps of dense and overlapping mushroom clusters are segmented and reconstructed at high precision and fast speed, and the fitting degree between a reconstructed contour edge and an actual edge of a mushroom is relatively high, such that the positioning of a center point is more accurate; and the present invention is suitable for high-precision recognition and positioning of sporocarps of mushrooms such as Agaricus bisporus, Agaricus blazei Murill, Flammulina velutipes, Hypsizygus marmoreus and Pleurotus eryngii.

Inventors:
YANG SHUZHEN (CN)
ZHU HAOYU (CN)
YU TAO (CN)
Application Number:
PCT/CN2023/098787
Publication Date:
April 18, 2024
Filing Date:
June 07, 2023
Export Citation:
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Assignee:
UNIV SHANGHAI POLYTECH (CN)
International Classes:
G06V10/26
Domestic Patent References:
WO2013154062A12013-10-17
Foreign References:
CN115601543A2023-01-13
CN111445482A2020-07-24
CN113077453A2021-07-06
CN110059663A2019-07-26
Attorney, Agent or Firm:
SHANGHAI TECHNOVO INTELLECTUAL PROPERTY AGENT FIRM (CN)
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