Title:
MULTILAYER METAL THIN FILM AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/255687
Kind Code:
A1
Abstract:
The present specification relates to a multilayer metal thin film and a manufacturing method therefor, the multilayer metal thin film comprising: a first plating layer; a metal layer formed on the upper surface of the first plating layer and comprising copper; a second plating layer formed on the upper surface of the metal layer; and a third plating layer formed on the second plating layer, wherein the first plating layer, the metal layer, the second plating layer and the third plating layer are sequentially plated on an anode-rotating plate by means of electroforming.
Inventors:
LEE DAE IN (KR)
LEE JONG IN (KR)
LEE YE KUN (KR)
LEE JONG IN (KR)
LEE YE KUN (KR)
Application Number:
PCT/KR2022/006964
Publication Date:
December 08, 2022
Filing Date:
May 16, 2022
Export Citation:
Assignee:
DIVE CO LTD (KR)
LEE DAE IN (KR)
LEE JONG IN (KR)
LEE DAE IN (KR)
LEE JONG IN (KR)
International Classes:
C25D1/04; C25D1/00; C25D5/10
Foreign References:
| KR101991922B1 | 2019-06-21 | |||
| KR20160058557A | 2016-05-25 | |||
| KR20090116515A | 2009-11-11 | |||
| KR20150120878A | 2015-10-28 | |||
| KR20180110102A | 2018-10-08 | |||
| KR20030009715A | 2003-02-05 |
Attorney, Agent or Firm:
OAM PATENT & TRADEMARK LAW FIRM (KR)
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