Title:
MULTILAYER CMP PADS
Document Type and Number:
WIPO Patent Application WO/2024/050141
Kind Code:
A3
Abstract:
A polishing pad comprising a textile layer, a compressible layer, and a water impermeable layer disposed between the textile layer and the compressible layer. The polishing pad reduces slurry use by improving slurry transport and requires no diamond conditioning to maintain slurry transport.
Inventors:
BAJAJ RAJEEV (US)
NAMAN ANANTH (US)
NAMAN ANANTH (US)
Application Number:
PCT/US2023/031943
Publication Date:
April 11, 2024
Filing Date:
September 03, 2023
Export Citation:
Assignee:
BAJAJ RAJEEV (US)
NAMAN ANANTH (US)
NAMAN ANANTH (US)
International Classes:
H01L21/321; B24D11/00; H01L21/461; C09K3/14; H01L21/302
Attorney, Agent or Firm:
ELLIS, George (US)
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