Title:
MULTI-WIRE ELECTRIC DISCHARGE MACHINING APPARATUS, MULTI-WIRE ELECTRIC DISCHARGE MACHINING METHOD, THIN PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/181305
Kind Code:
A1
Abstract:
Provided is a multi-wire electric discharge machining apparatus comprising: a plurality of guide rollers around which a wire electrode is wound a plurality of times to guide the travel of the wire electrode; a machining power supply that applies a voltage between a workpiece (2) and each of a plurality of cutting wire sections, which are portions of the wire electrode running in parallel between a first guide roller and a second guide roller included in the plurality of guide rollers; a dummy workpiece (25) including a contact surface curved so as to be capable of coming in contact with a portion which is of a curved surface of the workpiece (2) and is other than end points each reached by each of the plurality of cutting wire sections at an end time of the machining of the workpiece (2), the dummy workpiece (25) supporting the workpiece (2) from one side in a first direction in which the workpiece (2) moves relative to the plurality of cutting wire sections; and a pushing mechanism (26) which has a pushing part (28) that can contact the curved surface of the workpiece (2) and which pushes the workpiece (2) toward the dummy workpiece (25) by bringing the workpiece (2) in contact with the holding part (28) from the other side in the first direction.
Inventors:
ITOKAZU ATSUSHI (JP)
OTOMO YOICHI (JP)
YAGI TSUBASA (JP)
OTOMO YOICHI (JP)
YAGI TSUBASA (JP)
Application Number:
PCT/JP2022/014162
Publication Date:
September 28, 2023
Filing Date:
March 24, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23H7/02; B28D5/04
Domestic Patent References:
| WO2011145390A1 | 2011-11-24 |
Foreign References:
| JPH09272122A | 1997-10-21 | |||
| JP2000006138A | 2000-01-11 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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