Title:
MULTI-CHIP INTERCONNECTION PACKAGING STRUCTURE HAVING HEAT DISSIPATION PLATE, AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/082332
Kind Code:
A1
Abstract:
The invention provides a multi-chip interconnection packaging structure having a heat dissipation plate, and a preparation method therefor, and relates to the technical field of advanced semiconductor packaging. The multi-chip interconnection packaging structure having a heat dissipation plate comprises: a fine circuit layer, a packaging chip, a heat dissipation plate, a plastic packaging body, and a packaging circuit layer; the heat dissipation plate is arranged on the fine circuit layer and is attached to the side of the packaging chip away from the fine circuit layer; the plastic packaging body covers the outsides of the packaging chip and the heat dissipation plate, and the packaging circuit layer is disposed on the plastic packaging body. Compared with the prior art, the present application using a fine circuit package, adding a heat dissipation plate, and the heat dissipation plate simultaneously being in contact with the fine circuit layer and the packaging chip, makes it so that the heat generated by the packaging chip and the fine circuit layer can be rapidly led away and transmitted to the outside, thereby greatly improving the heat dissipation capacity of the fine circuit packaging structure, and successfully satisfying the requirements of system packaging simultaneously requiring fine interconnection, high-density packaging, and good heat dissipation capacity.
Inventors:
YAN YINGQIANG (CN)
HU CHUAN (CN)
WANG YAO (CN)
ZHENG WEI (CN)
CHEN ZHITAO (CN)
HU CHUAN (CN)
WANG YAO (CN)
ZHENG WEI (CN)
CHEN ZHITAO (CN)
Application Number:
PCT/CN2022/128043
Publication Date:
April 25, 2024
Filing Date:
October 27, 2022
Export Citation:
Assignee:
INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES (CN)
International Classes:
H01L23/367; H01L23/528
Foreign References:
| KR20040037561A | 2004-05-07 | |||
| US20030210533A1 | 2003-11-13 | |||
| KR101450761B1 | 2014-10-16 | |||
| CN111755350A | 2020-10-09 | |||
| US20100084761A1 | 2010-04-08 | |||
| US20170186665A1 | 2017-06-29 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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