Title:
MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT AND OUTDOOR UNIT OF AIR CONDITIONING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/162249
Kind Code:
A1
Abstract:
A mounting structure (70) for an electronic component is provided with an electronic component (10), a metal plate (30) having one surface (31) and the other surface (32), and a heat dissipating member (20) having flexibility and elasticity. The heat dissipating member (20) is sandwiched between the electronic component (10) and the one surface (31) of the metal plate (30), has an area that faces the electronic component (10) and is in close contact with the electronic component (10) by deforming along the shape of the electronic component (10), and is in close contact with the one surface of the metal plate (30). The electronic component (10) and the metal plate (30) are thermally connected to each other via the heat dissipating member (20).
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Inventors:
SUZUKI HIROKI (JP)
HARADA KEIJI (JP)
HARADA KEIJI (JP)
Application Number:
PCT/JP2022/008364
Publication Date:
August 31, 2023
Filing Date:
February 28, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01F37/00; H01F27/06; H01F27/22
Foreign References:
| JP2018006650A | 2018-01-11 | |||
| JP2015043377A | 2015-03-05 | |||
| JP2014179478A | 2014-09-25 | |||
| JP2012145287A | 2012-08-02 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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