Title:
MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/057887
Kind Code:
A1
Abstract:
Provided is a mounting device that acquires position information about a substrate recognition mark and achieves highly accurate mounting, even when a chip component covers the substrate recognition mark in facedown mounting. Specifically, provided is a mounting device comprising: an attachment tool that holds a surface of a chip component opposite to a surface having a chip recognition mark; a substrate stage that holds a substrate; a reflective light source that emits, toward the surface of the substrate from the attachment tool side, light containing a wavelength which is transmitted through the chip component; and a recognition means for recognizing reflected light of the light emitted by the reflective light source, wherein the recognition means acquires an image formed by the light that has been transmitted through the chip component and reflected at the substrate, and acquires position information about the substrate recognition mark.
Inventors:
AOKI SHIMPEI (JP)
HARE TAKASHI (JP)
MIHARA KENTARO (JP)
HARE TAKASHI (JP)
MIHARA KENTARO (JP)
Application Number:
PCT/JP2023/030848
Publication Date:
March 21, 2024
Filing Date:
August 28, 2023
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L21/60; H05K13/04; H05K13/08
Domestic Patent References:
| WO2003041478A1 | 2003-05-15 | |||
| WO2020044580A1 | 2020-03-05 |
Foreign References:
| JP2003249425A | 2003-09-05 |
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