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Patent Searching and Data


Title:
MOUNTING DEVICE AND METHOD FOR MOUNTING INFORMATION ACQUISITION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/223749
Kind Code:
A1
Abstract:
Provided are: a mounting device that makes it possible to easily mount an information acquisition device at an arbitrarily defined place on piping; and a method for mounting the information acquisition device. This mounting device is for mounting, by forming a through-bore 2a in an outer circumferential surface of piping (water pipe 2) by means of a boring machine 70, an information acquisition device 80 that acquires information about the inside of the piping (water pipe 2) via the through-bore 2a. The mounting device comprises: a piping mounting part 10 that is mounted to the piping (water pipe 2) and that has an opening 11b which is connected to the through-bore 2a; a valve part 30 which is mounted so as to be connected to the opening 11b; a valve connection part (lower valve connection part 20) which connects between the opening 11b and the valve part 30; and a mounting part 50 to which the boring machine 70 or the information acquisition device 80 can be mounted.

Inventors:
MORIMURA MASARU (JP)
NISHINO MAIKO (JP)
Application Number:
PCT/JP2023/015460
Publication Date:
November 23, 2023
Filing Date:
April 18, 2023
Export Citation:
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Assignee:
KUBOTA KK (JP)
International Classes:
F16L41/06; F16L1/028; F16L55/00
Foreign References:
JPH0365094U1991-06-25
JP2003254489A2003-09-10
KR101285706B12013-07-12
KR101706762B12017-02-16
US20190011071A12019-01-10
JP2005265058A2005-09-29
JP2002241975A2002-08-28
CN214557612U2021-11-02
Attorney, Agent or Firm:
NAGATA Toyohiko et al. (JP)
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