Title:
MOLDING METHOD FOR ROLLING-ELEMENT HOUSING BAND, AND MANUFACTURING MOLD
Document Type and Number:
WIPO Patent Application WO/2023/195373
Kind Code:
A1
Abstract:
This method is employed for a linear guide device (100) having a plurality of rolling-element rows between a raceway member (110) and a moving member (120), and is for injection-molding, by means of a mold (400), a rolling-element housing band (300) that retains the plurality of rolling-element rows as a unit. The method is characterized in that: the mold (400) is provided with a plurality of gates (410) through which synthetic resin is injected into a cavity (420); a plurality of pseudo rolling elements (430) are arranged in a staggered manner in the cavity (420) of the mold (400) to configure a plurality of pseudo rolling-element rows corresponding to the plurality of rolling-element rows; and among the plurality of pseudo rolling-element rows, a pseudo rolling-element row provided with the gates (410) and a pseudo rolling-element row not provided with the gates (410) adjoin each other.
Inventors:
TAKAHASHI TORU
YAMAKOSHI RYUICHI
YAMAKOSHI RYUICHI
Application Number:
PCT/JP2023/012270
Publication Date:
October 12, 2023
Filing Date:
March 27, 2023
Export Citation:
Assignee:
THK CO LTD (JP)
International Classes:
B29C45/26; F16C29/06; F16C33/42
Foreign References:
| JP2018197559A | 2018-12-13 | |||
| JP2006153164A | 2006-06-15 | |||
| JP2019126959A | 2019-08-01 | |||
| JP2020056417A | 2020-04-09 | |||
| JP2019199915A | 2019-11-21 | |||
| JPH0929776A | 1997-02-04 |
Attorney, Agent or Firm:
IDE Tetsuroh (JP)
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