Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDED ARTICLE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/079833
Kind Code:
A1
Abstract:
The technology disclosed in the specification of the present application is used for the purpose of improving the wear resistance of a member that is used in a substrate processing apparatus. A molding method related to the technology disclosed in the description of the present application is used for the purpose of obtaining a molded article that is used in a substrate processing apparatus. This molding method comprises a step in which the molded article that is formed of a copolymer of tetrafluoroethylene and ethylene is irradiated with an electron beam.

Inventors:
OKAMOTO YOSHIO (JP)
NISHIDE HAJIME (JP)
BABA MASATO (JP)
Application Number:
PCT/JP2022/034042
Publication Date:
May 11, 2023
Filing Date:
September 12, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; C08J7/00
Foreign References:
JP2002338713A2002-11-27
JP2018035234A2018-03-08
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF: