Title:
MOLD FOR TRANSFERRING FINE PATTERN AND METHOD FOR FORMING FINE PATTERN
Document Type and Number:
WIPO Patent Application WO/2020/217547
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a mold for transferring a fine pattern, with which it is possible to transfer a high-definition fine pattern to the interior of a hollow product through integral molding; and a method for forming a fine pattern. According to the present invention, in a product-forming space that is formed by clamping of a mold body so as to comprise a cavity part and a core pin part for fixing a fine pattern original plate to a prescribed location, a gate part through which a molten resin material is injected from a hot runner part is opened on one end side of a fixing surface of the fine pattern original plate in such a manner as to level out with said fixing surface, and the gate part is directly linked to an injection nozzle of the hot runner part. Then, the hollow product is integrally molded with the resin material injected from the gate part.
Inventors:
HASHIMOTO HISASHI (JP)
Application Number:
PCT/JP2019/023900
Publication Date:
October 29, 2020
Filing Date:
June 17, 2019
Export Citation:
Assignee:
SANKO KASEI CO LTD (JP)
International Classes:
B29C45/26
Foreign References:
| JP2001038773A | 2001-02-13 | |||
| JP2011194594A | 2011-10-06 | |||
| JP2014108579A | 2014-06-12 | |||
| JP2017094592A | 2017-06-01 |
Attorney, Agent or Firm:
TOHDA, Kiyoshi (JP)
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