Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2024/053483
Kind Code:
A1
Abstract:
Provided is a mold release film configured so that, when peeling off a sheet-like molding after half cutting, a problem caused by adherence of the sheet-like molding to half-cut sections is unlikely to occur. This mold release film has a substrate film and a mold release layer. Regarding the mold release layer, in a micro slurry jet erosion test with a projection force for which the erosion rate is 0.019 μm/g with respect to polymethyl methacrylate resin, the erosion rate is 0.003 μm/g or more when a slurry, obtained by dispersing polygonal alumina particles having a mean particle diameter (D50) of 0.3 μm in water, is projected.
Inventors:
YANO SHINJI (JP)
Application Number:
PCT/JP2023/031214
Publication Date:
March 14, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/36; C08J7/04
Domestic Patent References:
| WO2008020635A1 | 2008-02-21 | |||
| WO2017200056A1 | 2017-11-23 |
Foreign References:
| JP2013208810A | 2013-10-10 | |||
| JP2014083697A | 2014-05-12 | |||
| JP2021011081A | 2021-02-04 | |||
| JP2022036894A | 2022-03-08 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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