Title:
MOLD RELEASE FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2024/058163
Kind Code:
A1
Abstract:
Provided are: a mold release film that enables a reduction in the amount of organic solvents which are hazardous to the human body and which have an adverse impact on the environment, and achieves both good wettability and easy release properties of a thin-film resin sheet, particularly, a thin-film ceramic green sheet; and a method for producing the mold release film. The present invention pertains to: a mold release film having a mold release layer on at least one surface of a polyester film; and a method for producing the mold release film. The mold release layer is obtained by reacting and solidifying an aqueous coating composition. The aqueous coating composition contains 10 parts by mass or less of an organic solvent with respect to a total of 100 parts by mass of the coating composition. The composition contains (a) a first silicone emulsion having at least two alkenyl groups per molecule, (b) a second silicone emulsion having at least two hydrogen groups per molecule, and (d) a surfactant. The adhesion energy of the surface of the mold release layer as calculated from the sliding angle of water is at least 6.0 mJ/m2. The tape release force of the surface of the mold release layer is at most 2000 mN/50 mm.
Inventors:
SHIGENO KENTO (JP)
YANO SHINJI (JP)
YANO SHINJI (JP)
Application Number:
PCT/JP2023/033171
Publication Date:
March 21, 2024
Filing Date:
September 12, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B05D5/08; B05D7/04; B05D7/24; B28B1/30; B32B7/06; B32B27/36; C09D5/02; C09D7/63; C09D183/05; C09D183/07; H01G13/00
Domestic Patent References:
| WO2022163569A1 | 2022-08-04 |
Foreign References:
| JP2021011081A | 2021-02-04 | |||
| JP2014156560A | 2014-08-28 | |||
| JP2020059252A | 2020-04-16 | |||
| JP2017525794A | 2017-09-07 | |||
| JP2023055188A | 2023-04-17 | |||
| JP2023145969A | 2023-10-12 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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