Title:
MOLD RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/057771
Kind Code:
A1
Abstract:
Provided is a mold release film including a mold release layer and a base material layer, the elongation rate at break of the mold release layer being 120% or greater, and the average thickness of the mold release layer being 5 μm or greater.
Inventors:
NAKAMURA KOJI (JP)
Application Number:
PCT/JP2023/028608
Publication Date:
March 21, 2024
Filing Date:
August 04, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/56; B29C33/68; B29C43/18; B29C45/02; B29C45/14; B32B27/00
Foreign References:
| JP2020004896A | 2020-01-09 | |||
| JP2016127091A | 2016-07-11 | |||
| JP2014212239A | 2014-11-13 | |||
| JP2014227509A | 2014-12-08 | |||
| JP2010260928A | 2010-11-18 | |||
| JPS6015418A | 1985-01-26 | |||
| JP2019050420A | 2019-03-28 | |||
| JP2013071381A | 2013-04-22 | |||
| JP2002301790A | 2002-10-15 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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