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Title:
MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION, AND USE OF RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/077887
Kind Code:
A1
Abstract:
Provided in the present invention are a modified bismaleimide prepolymer, and a resin composition and the use thereof. The modified bismaleimide prepolymer is obtained by reacting a bismaleimide compound with an aminosilicone resin A and an aminosilicone resin B, wherein the amino equivalent EaA of the aminosilicone resin A is different from the amino equivalent EaB of the aminosilicone resin B, and the ratio of the total mass of the aminosilicone resin A and the aminosilicone resin B to the mass of the bismaleimide compound is (5-80) : 100. In the present invention, the reactivity of the bismaleimide compound is improved, and when the modified bismaleimide prepolymer is used in the field of substrate materials such as package substrates, the rheological properties thereof during high-temperature lamination are controlled.

Inventors:
CUI CHUNMEI (CN)
JIAO FENG (CN)
WANG HUI (CN)
CHEN XIANGXIU (CN)
DING TIEKUANG (CN)
Application Number:
PCT/CN2023/085349
Publication Date:
April 18, 2024
Filing Date:
March 31, 2023
Export Citation:
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Assignee:
SHENGYI TECH SUZHOU CO LTD (CN)
SHENGYI TECH CHANGSHU CO LTD (CN)
International Classes:
C08G77/455; B32B27/04; C08L79/04; C08L83/10
Foreign References:
CN103342894A2013-10-09
CN104830059A2015-08-12
CN107254049A2017-10-17
CN108137800A2018-06-08
CN108559209A2018-09-21
CN108779247A2018-11-09
CN112080102A2020-12-15
CN113121586A2021-07-16
CN115850710A2023-03-28
JP2012236920A2012-12-06
JP2016033195A2016-03-10
JPH0356533A1991-03-12
JPH0525452A1993-02-02
US4774282A1988-09-27
US4885329A1989-12-05
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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