Title:
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/141799
Kind Code:
A1
Abstract:
Provided are: a microetchant which forms roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shapes excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a process for producing a wiring board which includes a step in which a copper surface is roughened using the microetchant. The microetchant for copper of the present invention is an acidic aqueous solution containing an inorganic acid, a source of cupric ions, a source of halide ions, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetchant contain a source of sulfate ions.
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Inventors:
MATSUMOTO KEISUKE (JP)
Application Number:
PCT/JP2017/004653
Publication Date:
August 24, 2017
Filing Date:
February 08, 2017
Export Citation:
Assignee:
MEC CO LTD (JP)
International Classes:
C23F1/18; H01L21/306; H01L21/308; H05K3/38
Domestic Patent References:
| WO2010071078A1 | 2010-06-24 | |||
| WO2007024312A1 | 2007-03-01 |
Foreign References:
| JP2010525175A | 2010-07-22 | |||
| JP2006299359A | 2006-11-02 | |||
| JP2006028556A | 2006-02-02 | |||
| JPH0941163A | 1997-02-10 | |||
| JP2002047583A | 2002-02-15 |
Other References:
See also references of EP 3388551A4
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
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