MICRO-NANO TEXTURED CUTTING TOOL HAVING LARGE DEPTH TO DIAMETER RATIO, MACHINING APPARATUS AND MACHINING METHOD THEREFOR

WIPO Patent Application WO/2023/087708

A1

A micro-nano textured cutting tool having a large depth to diameter ratio, a machining apparatus and a machining method therefor, wherein the machining apparatus comprises a laser emission unit, a plasma induction unit and a mobile platform, and the plasma induction unit further comprises a magnetic field generation mechanism used for applying a magnetic field to induced plasma (33). According to the machining method, a micro-nano textured groove (22) is formed by machining on a surface to be machined of a cutting tool body (21) by means of the plasma (33) induced by laser, and the movement speed of the plasma (33) is increased and the energy density of the plasma (33) is increased by applying a magnetic field to the induced plasma (33), so that the micro-nano textured groove (22) having a large depth-diameter ratio is obtained. The movement of the plasma (33) induced by the laser is accelerated using magnetic field distribution, and then a micro-nano texture having a large depth-diameter ratio is prepared on the rear surface of the cutting tool body by using the accelerated plasma (33).

LIU YAYUN (CN)
WANG CHUANYANG (CN)
LIU TONGSHUN (CN)
ZHANG KEDONG (CN)

PCT/CN2022/100857

May 25, 2023

June 23, 2022

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UNIV SOOCHOW (CN)

B23K26/352; B08B7/02; B23B27/00; B23K10/00

CN114054961A	2022-02-18
CN110016642A	2019-07-16
CN111702353A	2020-09-25
CN113102390A	2021-07-13
CN111843124A	2020-10-30
US4042325A	1977-08-16

CENTRAL SOUTH WELL INTELLECTUAL PROPERTY OFFICE (CN)

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