Title:
MICRO LED PACKAGE STRUCTURE AND MICRO LED OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2023/125982
Kind Code:
A1
Abstract:
A micro LED package structure and a micro LED optical module. The micro LED package structure comprises: a main circuit board(1101), several circuit branches(1102,1103,1104) and several micro LED panels(201,202,203). The main circuit board(1101) comprises a printed circuit for controlling the micro LED panels(201,202,203); the circuit branches(1102,1103,1104) are separately connected with the main circuit board(1101); and, the micro LED panels(201,202,203) are separately configured onto the end surfaces of the circuit branches(1102,1103,1104). The disclosure simplifies the package structure of the micro LED, controls the chief ray angle of the micro LED structure, reduces the loss of the light emitting from the sidewall of the mesa, and further decreases the volume and the weight of the micro LED optical module.
Inventors:
ZHANG SHUAI (CN)
XU HUIWEN (CN)
XU HUIWEN (CN)
Application Number:
PCT/CN2022/144181
Publication Date:
July 06, 2023
Filing Date:
December 30, 2022
Export Citation:
Assignee:
JADE BIRD DISPLAY SHANGHAI LTD (CN)
International Classes:
G03B21/20
Foreign References:
| CN113219660A | 2021-08-06 | |||
| JPH11249070A | 1999-09-17 | |||
| CN113238438A | 2021-08-10 | |||
| CN109976079A | 2019-07-05 | |||
| JP2008158255A | 2008-07-10 | |||
| US10288797B1 | 2019-05-14 |
Attorney, Agent or Firm:
WU, FENG & ZHANG (CN)
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