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Patent Searching and Data


Title:
MICRO-FLUIDIC CHIP AND USE METHOD THEREFOR, AND MICRO-FLUIDIC SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/173277
Kind Code:
A1
Abstract:
The present disclosure provides a micro-fluidic chip and a use method therefor, and a micro-fluidic system. The micro-fluidic chip comprises: a substrate layer, the substrate layer comprising a base substrate and a driving electrode layer located on the base substrate; and a cover plate layer, arranged opposite to the substrate layer, and a space between the cover plate layer and the substrate layer forming a solution accommodating space, wherein the cover plate layer comprises a liquid inlet hole, a liquid outlet hole, and a plurality of limiting grooves arranged in an array on the side of the cover plate layer facing the substrate layer; the liquid inlet hole, the liquid outlet hole, and each limiting groove are all in communication with the solution accommodating space; and the end surface of the liquid inlet hole adjacent to the substrate layer, the end surface of the liquid outlet hole adjacent to the substrate layer, and opening surfaces of the plurality of limiting grooves are approximately flush with each other.

Inventors:
PENG KANG (CN)
DING DING (CN)
LIU ZHUKAI (CN)
Application Number:
PCT/CN2022/080896
Publication Date:
September 21, 2023
Filing Date:
March 15, 2022
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
International Classes:
B01L3/00; H01L21/02
Foreign References:
CN112892626A2021-06-04
CN111013676A2020-04-17
CN110270386A2019-09-24
CN107583692A2018-01-16
US20200319135A12020-10-08
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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