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Title:
MG-SB-BASED THERMOELECTRIC DEVICE COMPRISING HIGH-ENTROPY THERMOELECTRIC INTERFACE MATERIAL, AND PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/060114
Kind Code:
A1
Abstract:
An Mg-Sb-based thermoelectric device comprising a high-entropy thermoelectric interface material, and a preparation method. The thermoelectric device comprises a thermoelectric conversion material and a thermoelectric interface material. The thermoelectric interface material is compounded onto at least part of the surface of the thermoelectric conversion material; and the thermoelectric interface material comprises the following chemical general formula: FeaTibCrcMndMge, where a = 0.5-1.5; b = 0.5-1.5; c = 0.5-1.5; d = 0.5-1.5; and e = 0.5-1.5. The FeaTibCrcMndMge/TEcM contact interface not only has superior comprehensive performance after synthesis, but also still has a high shear strength (> 30 MPa) and a low contact resistance (< 10 μΩ*cm2) after 15 days of service at 400ºC.

Inventors:
LIU WEISHU (CN)
WU XINZHI (CN)
HAN ZHIJIA (CN)
ZHU KANG (CN)
Application Number:
PCT/CN2022/120435
Publication Date:
March 28, 2024
Filing Date:
September 22, 2022
Export Citation:
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Assignee:
UNIV SOUTHERN SCI & TECH (CN)
International Classes:
H10N10/817; C22C30/00; H10N10/01; H10N10/852
Foreign References:
CN115020577A2022-09-06
CN113828906A2021-12-24
CN114284422A2022-04-05
CN114645174A2022-06-21
JP2014086623A2014-05-12
CN108531795A2018-09-14
Other References:
WU XINZHI, HAN ZHIJIA, ZHU YONGBIN, DENG BIAO, ZHU KANG, LIU CHENGYAN, JIANG FENG, LIU WEISHU: "A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs", ACTA MATERIALIA., ELSEVIER, OXFORD, GB, vol. 226, 1 March 2022 (2022-03-01), GB , pages 117616, XP093150041, ISSN: 1359-6454, DOI: 10.1016/j.actamat.2021.117616
Attorney, Agent or Firm:
DHC IP ATTORNEYS (CN)
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