Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHODS FOR PRODUCING RESIN GRANULES DENSELY FILLED WITH FILLER AND MOLDED PRODUCT CONSISTING THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/028911
Kind Code:
A1
Abstract:
A method for producing resin granules having a filler filled in polymer at a high density. A method for producing a resin molded product by using the produced resin granules densely filled with a filler. A filler having a flat shape is used to process resin granules into a sheet−form molded product having an improved filler orientation, whereby a resin molded product making a good use of the above orientation is produced by a prepreg molding method. A resin molded product using an electromagnetic wave absorbing material as a filler can be universally used for electromagnetic wave absorption in a mobile communications equipment using a pseudo−microwave&sol microwave region.

Inventors:
YAMADA KATSUYA (JP)
YOSHISAKA TAKUMA (JP)
IKEDA KAZUAKI (JP)
Application Number:
PCT/JP2002/009803
Publication Date:
April 10, 2003
Filing Date:
September 24, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO ELEC FINE POLYMER INC (JP)
YAMADA KATSUYA (JP)
YOSHISAKA TAKUMA (JP)
IKEDA KAZUAKI (JP)
International Classes:
B29B9/12; H01Q17/00; H05K9/00; B29C43/00; (IPC1-7): B09B9/00; B29C43/02; B29C43/34; C08J3/12; C08K3/08; C08K7/00; C08L101/00; H01F1/00; H01Q17/00; H05K9/00
Foreign References:
JPS60240736A1985-11-29
JPS608014A1985-01-16
JPS5528873A1980-02-29
JPS4926367A1974-03-08
JPH03108301A1991-05-08
JP2001076913A2001-03-23
EP1096844A12001-05-02
Attorney, Agent or Firm:
Nakano, Minoru c/o Sumitomo Electric Industries Ltd. (1-3, Shimaya 1-chome, Konohana-k, Osaka-shi Osaka, JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: DEVICE FOR THE SEPARATION OF FLAT MAILINGS INTO THICKNESS CLASSES

Next Patent: METHOD AND SYSTEM FOR THERMAL TREATMENT OF RAILS