METHOD FOR THREE-DIMENSIONALLY MOLDING FILM, METHOD FOR MANUFACTURING FILM MOLDED BODY, AND FILM MOLDED BODY

Title:

METHOD FOR THREE-DIMENSIONALLY MOLDING FILM, METHOD FOR MANUFACTURING FILM MOLDED BODY, AND FILM MOLDED BODY

Document Type and Number:

WIPO Patent Application WO/2019/163305

Kind Code:

A1

Abstract:

Provided are a method for three-dimensionally molding a film, a method for manufacturing a film molded body, and a film molded body with which it is possible to easily apply three-dimensional molding to an inner film part while achieving a reduction of processing time and a decrease in energy consumption and without requiring a design change in existing equipment. The method for three-dimensionally molding a film comprises applying cold compression molding in a thickness direction to a film overlapped portion 50 in which at least one inner film part 20 having a first layer 21 and a second layer 22 having elasticity smaller than that of the first layer is arranged between two outer film parts 30 in a non-fixed state with respect to the outer film parts 30, thereby causing the inner film part 20 to protrude toward the second layer 22 side at the film overlapped portion 50.

Inventors:

TANAKA HIROKI (JP)
YASUUMI TAKAHIRO (JP)
ISHIZAKA KOUICHI (JP)
HATA MOTOHIDE (JP)
SHISHIDO SHOUTARO (JP)

Application Number:

PCT/JP2019/000047

Publication Date:

August 29, 2019

Filing Date:

January 07, 2019

Export Citation:

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Assignee:

TOYO SEIKAN KAISHA LTD (JP)

International Classes:

B31B70/64; B32B27/32; B65D30/16

Domestic Patent References:

WO2017104340A1

2017-06-22

Foreign References:

JP2014046655A	2014-03-17
JP2017141063A	2017-08-17
JP2004142132A	2004-05-20
JP2015037953A	2015-02-26
JP2016083797A	2016-05-19
JP2017140848A	2017-08-17
JP2017190178A	2017-10-19
US4373979A	1983-02-15
JP2010076132A	2010-04-08
JP2008290737A	2008-12-04

Other References: