Title:
METHOD FOR REMOVING LINEAR OBJECTS, DEVICE FOR REMOVING LINEAR OBJECTS, AND METHOD FOR PROCESSING ELECTRONIC/ELECTRICAL EQUIPMENT COMPONENT WASTE
Document Type and Number:
WIPO Patent Application WO/2021/177381
Kind Code:
A1
Abstract:
Provided are a method for removing linear objects, a device for removing linear objects, and a method for processing electronic/electrical equipment component waste with which make it possible to improve separation efficiency. The method for removing linear objects comprises: arranging a plurality of filters 3 inside a vibration sieve machine 1 adjacent to one another so as to partially overlap one another along the material supply direction, the filters 3 being provided with a plurality of rods 2 extending at intervals along the supply direction and a beam part 21 for supporting the plurality of rods 2 at one ends of the plurality of rods 2, the other ends 2b of the plurality of rods 2 being free ends; arranging a guide 6 below the tip end of the filter 3 positioned on the most downstream side in the supply direction; supplying materials including at least linear objects and plate-like objects to the inside of the vibration sieve machine 1; applying vibration to the filter 3; and sieving linear objects to the lower side of the sieve in the vibration sieve machine 1 and capturing a lump of linear objects by the guide 6, thereby separating the lump of linear objects from the plate-like objects.
Inventors:
AOKI KATSUSHI (JP)
Application Number:
PCT/JP2021/008282
Publication Date:
September 10, 2021
Filing Date:
March 03, 2021
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B07B1/12; B07B9/00; B09B5/00
Domestic Patent References:
WO2019151350A1 | 2019-08-08 | |||
WO2019151350A1 | 2019-08-08 |
Foreign References:
JP2019055390A | 2019-04-11 | |||
JP2009142765A | 2009-07-02 | |||
JP2020037070A | 2020-03-12 | |||
JP2015150505A | 2015-08-24 | |||
JP2015123418A | 2015-07-06 |
Other References:
See also references of EP 4115992A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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