Title:
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/080253
Kind Code:
A1
Abstract:
The present disclosure relates to a method for producing a semiconductor device, the method comprising: a resin film formation step in which a resin film is formed on a semiconductor wafer, the resin film containing a resin that is decreased in the molecular weight through a reaction with water; a production step of a semiconductor chip with a resin film piece, in which an individualized semiconductor chip with a resin film piece is produced by dicing the semiconductor wafer, on which the resin film has been formed, with use of a dicing blade; and a resin film piece removal step in which the resin film piece is removed from the semiconductor chip with a resin film piece by causing the resin in the resin film piece of the semiconductor chip with a resin film piece to react with water.
Inventors:
MIYAMOTO YUKI (JP)
MOROSAKI TOMOHITO (JP)
SUZUKI KATSUHIKO (JP)
WADA MASAYUKI (JP)
SAKAMOTO KEIICHI (JP)
WATANABE MASAHITO (JP)
KONDO HIDEKAZU (JP)
SAITO KOICHI (JP)
MOROSAKI TOMOHITO (JP)
SUZUKI KATSUHIKO (JP)
WADA MASAYUKI (JP)
SAKAMOTO KEIICHI (JP)
WATANABE MASAHITO (JP)
KONDO HIDEKAZU (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2023/036605
Publication Date:
April 18, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/301; H01L21/304
Foreign References:
| JP2020504454A | 2020-02-06 | |||
| JPS63228733A | 1988-09-22 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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