Title:
METHOD FOR PRODUCING LAMINATION MOLDED ARTICLE, HEAT-SENSITIVE GELLING AGENT, AND LAMINATION MOLDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/167259
Kind Code:
A1
Abstract:
This method for producing a lamination molded article comprises laminating a lamination molding composition containing a heat-sensitive gelling agent and a water-curable inorganic composition, and non-fluidizing the lamination molding composition through heating during lamination and/or after lamination, wherein the heat-sensitive gelling agent contains an aqueous medium, a polymer dispersed in the aqueous medium, and a nonionic surfactant having a cloud point of 30°C or more and an HLB value of 10-18; and when the intrusion resistance value at 17±3°C immediately after defoaming is denoted as a0, and the intrusion resistance value at 17±3°C after microwave heating at 600 W for 30 seconds after defoaming is denoted as a1, the value of a1/a0 of the heat-sensitive gelling agent is 15 or more.
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Inventors:
TANEMURA ATSUMI (JP)
Application Number:
PCT/JP2023/007687
Publication Date:
September 07, 2023
Filing Date:
March 01, 2023
Export Citation:
Assignee:
NIPPON A&L INC (JP)
International Classes:
B28B1/30; C04B24/20; C04B24/26; C04B28/02
Domestic Patent References:
| WO2020156358A1 | 2020-08-06 |
Foreign References:
| JP2005104749A | 2005-04-21 | |||
| JP2668580B2 | 1997-10-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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