Title:
A METHOD OF PROCESSING SILICON WAFER USED FOR SOLAR CELL
Document Type and Number:
WIPO Patent Application WO/2007/051356
Kind Code:
A1
Abstract:
A method of processing the silicon wafer used for solar cell comprises the following steps:
a relative interval between the wafers is initially fixed, at the same time a silicon
ingot or monocrystalline silicon rod is cut into wafers by a cutter; all wafers
holding the relative interval are clamped by the clamps after the cutting step;
the whole of the clamps clamping all silicon wafer is taken down, then an entire
process of cleaning, etching, re-cleaning or replacing the clamps is performed.
The processing method according to the invention shortens the period of the process
compared with the prior arts. The processes of the wafer being taken out of and
loaded in a space-stop rack piece by piece for several times and the wafer being
loaded in a case are avoided, labor power and material resources are saved, and
the percentage of damaging the silicon wafers and their corners are reduced. It’s
possible to allow a thinner silicon wafer to be cut, thereby improving greatly
production efficiency and yield.
Inventors:
YUAN JIANZHONG (CN)
Application Number:
PCT/CN2005/001866
Publication Date:
May 10, 2007
Filing Date:
November 07, 2005
Export Citation:
Assignee:
YUAN JIANZHONG (CN)
International Classes:
H01L21/687; H01L21/304
Domestic Patent References:
WO1997002905A1 | 1997-01-30 |
Foreign References:
JP2001185513A | 2001-07-06 | |||
US6367467B1 | 2002-04-09 | |||
US5421905A | 1995-06-06 | |||
JP2000061936A | 2000-02-29 |
Attorney, Agent or Firm:
SHANGHAI KAIJI INTELLECTUAL PROPERTY AGENT CO., LTD. (188 Nandandong Road, Shanghai 0, CN)
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