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Patent Searching and Data


Title:
METHOD FOR PRETREATMENT AND PRINTING OF FLEXIBLE SUBSTRATE AND SYSTEM USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/038578
Kind Code:
A1
Abstract:
Disclosed is a method for the pretreatment and printing of a flexible substrate. The method comprises the steps of: fixing a first pattern mask for the printing of at least one of an electrode and a circuit on the flexible substrate; performing a primary surface modification treatment on a portion of the flexible substrate exposed from the first pattern mask using an atmospheric-pressure plasma; forming at least one of the electrode and the circuit by printing a conductive ink on the primary surface modification treated portion of the flexible substrate; fixing a second pattern mask for an insulation treatment on the flexible substrate; performing a secondary surface modification treatment on a portion of the flexible substrate exposed from the second pattern mask using the atmospheric-pressure plasma; and forming an insulating film by printing a nonconductive ink on the secondary surface modification treated portion of the flexible substrate.

Inventors:
LEE MYUNG JAE (KR)
KANG SHIN UK (KR)
KIM DONG MIN (KR)
Application Number:
PCT/KR2017/009331
Publication Date:
March 01, 2018
Filing Date:
August 25, 2017
Export Citation:
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Assignee:
LEE MYUNG JAE (KR)
KANG SHIN UK (KR)
KIM DONG MIN (KR)
International Classes:
H05K3/12; H01J37/32; H05K1/09; H05K3/28
Foreign References:
KR20120066319A2012-06-22
JP5506401B22014-05-28
KR101631923B12016-06-20
KR20060059547A2006-06-02
KR20160087615A2016-07-22
Attorney, Agent or Firm:
KIM, In Han (KR)
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