METHOD FOR MANUFACTURING RESONANT STRUCTURE

WIPO Patent Application WO/2021/132195

A1

Provided is a method for manufacturing a novel resonant structure. This method for manufacturing a resonant structure includes a first conductor, a second conductor, a third conductor, and a fourth conductor. The third conductor expands along a first direction, is positioned between the first conductor and the second conductor, and is configured to capacitively connect the first conductor and the second conductor. The fourth conductor expands along the first direction, and is electrically connected to the first conductor and the second conductor. The method for manufacturing a resonant structure includes preparing a rectangular substrate in which a plurality of units corresponding to the resonant structure are aligned in a second direction intersecting the first direction. The method for manufacturing a resonant structure includes forming a conductor corresponding to the first conductor and a conductor corresponding to the second conductor at two end parts in the first direction of the rectangular substrate using a hot-dip coating method. The method for manufacturing a resonant structure includes cutting a plurality of units that are adjacent in the second direction along the first direction in a rectangular substrate.

UCHIMURA HIROSHI (JP)
HIRAMATSU NOBUKI (JP)
GO MASATOSHI (JP)
HASHIMOTO SUNAO (JP)

PCT/JP2020/047781

July 01, 2021

December 21, 2020

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KYOCERA CORP (JP)

H01P11/00; H01Q13/20; H05K3/00; H05K3/18

WO2011027582A1	2011-03-10
WO2010100932A1	2010-09-10

JPH05148651A	1993-06-15
JP2018050240A	2018-03-29

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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