Title:
METHOD FOR MANUFACTURING LAYERED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/014387
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for manufacturing a layered structure in which it is easy to control the crystal structure in the layered structure. A method for manufacturing a layered structure is selected in which: a gas flow parallel to the surface of a powder bed is provided; an energy beam is radiated while being scanned in a first direction to form a first melt-solidified layer; an energy beam is radiated while being scanned in a second direction intersecting the first direction to form a second melt-solidified layer; a first accumulation thickness of the powder bed and a first heat input amount of the energy beam are adjusted to control the layering thickness of the first melt-solidified layer and the penetration depth of the first melt-solidified layer; a second accumulation thickness of the powder bed and a second heat input amount of the energy beam are adjusted to control the layering thickness of the second melt-solidified layer and the penetration depth of the second melt-solidified layer; the angle α1 between the first direction and the gas flow direction is adjusted to control the first heat input amount; the angle α2 between the second direction and the gas flow direction is adjusted to control the second heat input amount; and the residual thickness of the first melt-solidified layer and the residual thickness of the second melt-solidified layer in the crystal structure are controlled.
Inventors:
AMANO HIROKI (JP)
OYAMA TOMOHIRO (JP)
SASAKI TOMOAKI (JP)
AIBA KEISUKE (JP)
NAKANO TAKAYOSHI (JP)
ISHIMOTO TAKUYA (JP)
OYAMA TOMOHIRO (JP)
SASAKI TOMOAKI (JP)
AIBA KEISUKE (JP)
NAKANO TAKAYOSHI (JP)
ISHIMOTO TAKUYA (JP)
Application Number:
PCT/JP2023/025085
Publication Date:
January 18, 2024
Filing Date:
July 06, 2023
Export Citation:
Assignee:
TAIYO NIPPON SANSO CORP (JP)
UNIV OSAKA (JP)
UNIV OSAKA (JP)
International Classes:
B22F10/322; B22F10/28; B22F10/366; B22F10/38; B33Y10/00; B33Y50/02
Foreign References:
| JP2016517357A | 2016-06-16 | |||
| JP2016527390A | 2016-09-08 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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