Title:
METHOD FOR MANUFACTURING GLASS SUBSTRATE, AND GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/215628
Kind Code:
A1
Abstract:
The present invention suppresses a decrease in dimensional accuracy. This method for manufacturing a glass substrate supports a semiconductor device, and generates a glass mother plate, measures the thickness, thickness deviation, and warpage amount of the glass mother plate, selects the glass mother plate on the basis of the thickness of the glass mother plate, generates a plurality of glass base plates by cutting the selected glass mother plate, sets a first polishing condition for the glass base plates on the basis of the thickness, thickness deviation, and warpage amount of the glass mother plate, generates a glass plate by polishing the surface of the glass base plate on the basis of the first polishing condition, measures the thickness, thickness deviation, and warpage amount of the glass plate, selects the glass plate on the basis of the thickness of the glass plate, sets a second polishing condition for the glass plate on the basis of the thickness, thickness deviation, and warpage amount of the glass plate, polishes the surface of the selected glass plate on the basis of the second polishing condition, and generates a rectangular glass substrate in which the side length is 300 mm or greater and the thickness is 0.5 mm or greater.
Inventors:
KOBAYASHI YUHA (JP)
YOSHIDA YUICHI (JP)
HANASHIMA KEISUKE (JP)
YOSHIDA YUICHI (JP)
HANASHIMA KEISUKE (JP)
Application Number:
PCT/JP2022/016053
Publication Date:
October 13, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
H01L23/15; B24B7/24; B24B49/04; C03C19/00; C03C23/00
Domestic Patent References:
| WO2018207794A1 | 2018-11-15 | |||
| WO2021019654A1 | 2021-02-04 | |||
| WO2016190303A1 | 2016-12-01 |
Foreign References:
| JP2016124757A | 2016-07-11 | |||
| JP2020007184A | 2020-01-16 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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